Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

By Wei G.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

Springer Publishing Company

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Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization

By Wang Dong-Liang  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 61-67

Springer Publishing Company

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

Springer Publishing Company

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

Springer Publishing Company

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Interfacial reactions between Sn-3.5 Ag solder and Ni–W alloy films

By Haseeb A.   Chew C.   Johan Mohd  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. : 1372-1377

Springer Publishing Company

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