Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization

Author: Wang Dong-Liang  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.23, Iss.1, 2012-01, pp. : 61-67

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Abstract