Interfacial Reactions Between Liquid Sn-8Zn-3Bi Solders and Cu Substrates

Author: Lin W. H.   Chuang T. H.  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.12, Iss.4, 2003-08, pp. : 452-455

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Abstract