Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate

By Chan Y.H.   Arafat M.M.   Haseeb A.S.M.A.  

Soldering & Surface Mount Technology, Vol. 25, Iss. 2, 2013-04 ,pp. : 91-98

Emerald Group Publishing Ltd

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Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance ‐ ANOVA

By Bukat K.   Sitek J.   Kisiel R.   Moser Z.   Gasior W.   Koscielski M.   Pstrus J.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 9-19

Emerald Group Publishing Ltd

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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

By Shnawah Dhafer Abdul Ameer   Said Suhana Binti Mohd   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Che Fa Xing  

Soldering & Surface Mount Technology, Vol. 24, Iss. 4, 2012-09 ,pp. : 257-266

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Pb-Free Solders: Part 1. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions

By Moser Z.   Gąsior W.   Bukat K.   Pstruś J.   Kisiel R.   Sitek J.   Ishida K.   Ohnuma I.  

Journal of Phase Equilibria & Diffusion, Vol. 27, Iss. 2, 2006-04 ,pp. : 133-139

Springer Publishing Company

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

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