Creep properties of Sn-Ag solder joints containing intermetallic particles

Author： Choi S.   Lee J.   Guo F.   Bieler T.   Subramanian K.   Lucas J.  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.53, Iss.6, 2001-06, pp. : 22-26

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