Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particles

Author： Tai Feng Guo Fu Liu Jianping Xia Zhidong Shi Yaowu Lei Yongping Li Xiaoyan

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.22, Iss.4, 2010-09, pp. : 50-56

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Creep properties of Sn-Ag solder joints containing intermetallic particles

By Choi S. Lee J. Guo F. Bieler T. Subramanian K. Lucas J.

JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 22-26

Springer Publishing Company

Access to resources Recommend Favorite

Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder

By Liang J. Dariavach N. Shangguan D.

Metallurgical and Materials Transactions A, Vol. 38, Iss. 7, 2007-07 ,pp. : 1530-1538

Springer Publishing Company

Access to resources Recommend Favorite

The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong Sheng Mei Luo Le

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

Key Engineering Materials, Vol. 2017, Iss. 751, 2017-09 ,pp. : 9-13

Trans Tech Publications

Access to resources Recommend Favorite

Research Summary: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties

By Anderson I.E. Cook B.A. Harringa J.L. Terpstra R.L.

JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 26-29

Springer Publishing Company

Access to resources Recommend Favorite