The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Author： Deppisch Carl   Fitzgerald Thomas   Raman Arun   Hua Fay   Zhang Charles   Liu Pilin   Miller Mikel  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.58, Iss.6, 2006-06, pp. : 67-74

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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