Electroless gold plating from tetrachloroaurate solutions containing hexacyanoferrate(II) ions

By Vrublevskaya O. N.   Vorobyova T. N.   Lee H.-K.   Koo S.-B.  

Transactions of the Institute of Metal Finishing, Vol. 85, Iss. 5, 2007-09 ,pp. : 254-259

Maney Publishing

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Novel process of electroless Ni-P plating with replacement pretreatment on magnesium alloys

By Guo D   Wang B   Mao L   Fan Z-G  

Transactions of the Institute of Metal Finishing, Vol. 89, Iss. 2, 2011-03 ,pp. : 109-112

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Effect of UV irradiation on electroless Cu–Ni–P plating on cycloolefin polymer

By Inoue K. U.   Matsui K.   Watanabe M.   Honma H.  

Transactions of the Institute of Metal Finishing, Vol. 87, Iss. 1, 2009-01 ,pp. : 51-54

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Experimental investigation on the failure of lead-free solder joints under drop impact

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Failure analysis of lead-free solder joints for high-density packages

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