The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

Author: Liu Weiping   Lee Ning-Cheng  

Publisher: Springer Publishing Company

ISSN: 1543-1851

Source: JOM, Vol.59, Iss.7, 2007-07, pp. : 26-31

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract