Microcontact patterning of conductive silver lines by contact inking and its layer-transfer mechanisms

Author: Kusaka Yasuyuki   Nomura Ken-ichi   Fukuda Nobuko   Ushijima Hirobumi  

Publisher: IOP Publishing

E-ISSN: 1361-6439|25|5|55022-55030

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.5, 2015-05, pp. : 55022-55030

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