Development of a self-packaged 2D MEMS thermal wind sensor for low power applications

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|8|85011-85024

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.8, 2015-01, pp. : 85011-85024

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