Reflow flip-chip bonding technology for infrared detectors

Publisher: IOP Publishing

E-ISSN: 1361-6439|25|8|85009-85014

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.8, 2015-01, pp. : 85009-85014

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Abstract