Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections

Publisher： John Wiley & Sons Inc

E-ISSN： 1613-6829|11|33|4097-4103

ISSN： 1613-6810

Source： SMALL, Vol.11, Iss.33, 2015-09, pp. : 4097-4103

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