An empirical approach to modelling fluid dispensing for electronic packaging

Author: Kwong C.   Chan K.   Wong H.  

Publisher: Springer Publishing Company

ISSN: 0268-3768

Source: The International Journal of Advanced Manufacturing Technology, Vol.34, Iss.1-2, 2007-08, pp. : 111-121

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next