Ultra-thin layer packaging for implantable electronic devices

Author： Hogg A.   Aellen T.   Uhl S.   Graf B.   Keppner H.   Tardy Y.   Burger J.  

Publisher： IOP Publishing

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.23, Iss.7, 2013-07, pp. : 75001-75012

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