A Wafer-Level Sn-Rich Au—Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors

Author： Xu Mao   Xing-Dong Lv   Wei-Wei Wei   Zhe Zhang   Jin-Ling Yang   Zhi-Mei Qi   Fu-Hua Yang  

Publisher： IOP Publishing

ISSN： 0256-307X

Source： Chinese Physics Letters, Vol.31, Iss.5, 2014-05, pp. : 56803-56806

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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