Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Author： Bleiker Simon J.   Visser Taklo Maaike M.   Lietaer Nicolas   Vogl Andreas   Bakke Thor   Niklaus Frank  

Publisher： MDPI

E-ISSN： 2072-666x|7|10|192-192

ISSN： 2072-666x

Source： Micromachines, Vol.7, Iss.10, 2016-10, pp. : 192-192

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