A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

By Luo Zhenyu   Chen Deyong   Wang Junbo   Li Yinan   Chen Jian  

Sensors, Vol. 14, Iss. 12, 2014-12 ,pp. : 24244-24257

MDPI

Access to resources Recommend Favorite

Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

By Brito Nuno   Ferreira Carlos   Alves Filipe   Cabral Jorge   Gaspar João   Monteiro João   Rocha Luís  

Sensors, Vol. 16, Iss. 9, 2016-09 ,pp. : 1553-1553

MDPI

Access to resources Recommend Favorite

CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

By Chuang Wan-Chun   Hu Yuh-Chung   Chang Pei-Zen  

Sensors, Vol. 12, Iss. 12, 2012-12 ,pp. : 17094-17111

MDPI

Access to resources Recommend Favorite

Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

By Hamzah Azrul Azlan   Yunas Jumril   Majlis Burhanuddin Yeop   Ahmad Ibrahim  

Sensors, Vol. 8, Iss. 11, 2008-11 ,pp. : 7438-7452

MDPI

Access to resources Recommend Favorite

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

By Bleiker Simon J.   Visser Taklo Maaike M.   Lietaer Nicolas   Vogl Andreas   Bakke Thor   Niklaus Frank  

Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 192-192

MDPI

Access to resources Recommend Favorite