Reliability analysis of an ACA attached flex-on-board assembly for industrial application

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.26, Iss.2, 2014-04, pp. : 62-70

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Reliability and availability analysis for robot subsystem in automotive assembly plant: a case study

IOP Conference Series: Materials Science and Engineering, Vol. 100, Iss. 1, 2015-12 ,pp. : 187-193

IOP Publishing

Access to resources Recommend Favorite

Six sigma analysis of SMD feeding parameters and board assembly quality

By Kytösaho Pekka Liukkonen Timo

Soldering & Surface Mount Technology, Vol. 21, Iss. 3, 2009-06 ,pp. : 39-46

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of substrate material and thickness on reliability of ACA bonded flip chip joints

By Frisk Laura Cumini Anne

Soldering & Surface Mount Technology, Vol. 21, Iss. 3, 2009-06 ,pp. : 16-23

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Finite element analysis of flip?–?chip on board (FCOB) assembly during reflow soldering process

By Addagarla Annapurna Prasad N. Siva

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 92-99

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Premature Failures in Solder Joints Between I/O Pads and Flex-Circuit Board

By Krishnamoorthi V.

Practical Failure Analysis, Vol. 1, Iss. 5, 2001-10 ,pp. : 57-68

Springer Publishing Company

Access to resources Recommend Favorite