Electrodeposition of Cu onto Pt in presence of egg ovalbumin

Author： Bozzini B.   Campbell S. A.   D'Urzo L.  

Publisher： Maney Publishing

ISSN： 0020-2967

Source： Transactions of the Institute of Metal Finishing, Vol.85, Iss.3, 2007-05, pp. : 123-134

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Electrodeposition of a Cu–Cd Alloy in the Presence of Surfactant Mixtures from Several Reaction Series

By Shpan'ko S. P.   Grigor'ev V. P.   Dymnikova O. V.  

Protection of Metals, Vol. 40, Iss. 6, 2004-11 ,pp. : 551-555

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS)

By Bozzini B.   D'Urzo L.   Mele C.   Romanello V.  

Transactions of the Institute of Metal Finishing, Vol. 84, Iss. 2, 2006-03 ,pp. : 83-93

Maney Publishing

Access to resources Recommend Favorite

A study on cobalt electrodeposition onto a carbon steel electrode

By Ohba M.   Panossian Z.   Camargo P.  

Transactions of the Institute of Metal Finishing, Vol. 83, Iss. 4, 2005-08 ,pp. : 199-204

Maney Publishing

Access to resources Recommend Favorite

A study on zinc electrodeposition onto zinc cathode

By Ohba M.   Panossian Z.   Camargo P.  

Transactions of the Institute of Metal Finishing, Vol. 84, Iss. 6, 2006-11 ,pp. : 320-325

Maney Publishing

Access to resources Recommend Favorite

Thermodynamic assessment of the Cu−Pt system

By Abe Taichi   Sundman Bo   Onodera Hidehiro  

Journal of Phase Equilibria & Diffusion, Vol. 27, Iss. 1, 2006-02 ,pp. : 5-13

Springer Publishing Company

Access to resources Recommend Favorite