A study of chip-last embedded flip-chip package

Author： Chao Shin-Hua Tong Ho-Ming Hung Chih-Pin Lai Yishao Liu Colin Hsieh Emma Luh Ding-Bang

ISSN： 0253-3839

Source： Journal of the Chinese Institute of Engineers, Vol.37, Iss.6, 2014-08, pp. : 827-832

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