Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders

By Lin Chih-Kuang   Chu De-You  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 6, 2005-06 ,pp. : 355-365

Springer Publishing Company

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Formation of bulk Cu₆Sn₅ intermetallic compounds in Sn–Cu lead-free solders during solidification

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Journal of Materials Science, Vol. 42, Iss. 14, 2007-07 ,pp. : 5375-5380

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A study of Sn-Bi-Ag-(In) lead-free solders

By Shiue R-K.   Tsay L-W.   Lin C-L.   Ou J-L.  

Journal of Materials Science, Vol. 38, Iss. 6, 2003-03 ,pp. : 1269-1279

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Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

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Journal of Materials Science, Vol. 40, Iss. 12, 2005-06 ,pp. : 3267-3269

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Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

By Zhu Fulong   Zhang Honghai   Guan Rongfeng   Liu Sheng  

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