The Simulation and Analysis of Current Crowding and Joule Heat in Flip Chip Solder Bumps

Publisher： Trans Tech Publications

E-ISSN： 1662-9795|2015|645|319-324

ISSN： 1013-9826

Source： Key Engineering Materials, Vol.2015, Iss.645, 2015-06, pp. : 319-324

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract

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