Flip chip solder joint reliability under harsh environment

Author： Bo Cheng   Li Wang   Qun Zhang   Xia Gao   Xiaoming Xie   Kempe Wolfgang  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.15, Iss.3, 2003-12, pp. : 15-20

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