Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2015|830|265-269

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2015, Iss.830, 2015-10, pp. : 265-269

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