The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2014|803|228-232

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2014, Iss.803, 2015-01, pp. : 228-232

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The Effects of Zinc Addition on the Microstructure, Melting Point and Microhardness of Sn-0.7Cu Lead-Free Solder Fabricated via Powder Metallurgy Method

By  

Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 13-17

Trans Tech Publications

Access to resources Recommend Favorite

The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy

By  

Materials Science Forum, Vol. 2015, Iss. 819, 2015-07 ,pp. : 161-166

Trans Tech Publications

Access to resources Recommend Favorite

Effect of Fe Addition on Microstructure and Properties of Powder Metallurgy Ti35Nb10Ta Alloy

By  

Materials Science Forum, Vol. 2017, Iss. 899, 2017-08 ,pp. : 206-211

Trans Tech Publications

Access to resources Recommend Favorite

Micro-Hardness and Compression Strength of Particle Sizes Recycling Aluminium Alloy AA6061 Using Powder Metallurgy Method

By  

Materials Science Forum, Vol. 2017, Iss. 887, 2017-04 ,pp. : 74-82

Trans Tech Publications

Access to resources Recommend Favorite

Effect of silicon addition on microstructure and mechanical property of titanium nitride film prepared by plasma-assisted chemical vapor deposition

By Park B.H.   Kim Y.-I.   Kim K.H.  

Thin Solid Films, Vol. 348, Iss. 1, 1999-07 ,pp. : 210-214

Elsevier

Access to resources Recommend Favorite