Publisher: Trans Tech Publications
E-ISSN: 1662-9752|2015|817|510-515
ISSN: 0255-5476
Source: Materials Science Forum, Vol.2015, Iss.817, 2015-05, pp. : 510-515
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A new method for deposition of cubic Ta diffusion barrier for Cu metallization
By Yuan Z.L. Zhang D.H. Li C.Y. Prasad K. Tan C.M. Tang L.J.
Thin Solid Films, Vol. 434, Iss. 1, 2003-06 ,pp. :
Advanced plasma processing techniques for metallization in giga scale technology
By Dixit G.A.
Vacuum, Vol. 51, Iss. 4, 1998-12 ,pp. :
Metallization of cross-linked epoxy resins by reduction of polymer-incorporated metal ions
By Shibata M. Uda T. Yosomiya T.
Thin Solid Films, Vol. 440, Iss. 1, 2003-09 ,pp. :