Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy

Author: Park Sung-Hyeon   Jang Jin-Wook   Kim Hak-Sung  

Publisher: IOP Publishing

E-ISSN: 1361-6439|25|9|95007-95015

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.9, 2015-09, pp. : 95007-95015

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Abstract