Molecular Simulation Contribution to Porous Low-k Pore Size Determination after Damage by Etch and Wet Clean Processes - Invited Paper

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2016|255|215-222

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2016, Iss.255, 2016-10, pp. : 215-222

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