Endochronic Fatigue Life Prediction of SN/3.5AG/0.75CU BGA Solder Joints Under Oblique Displacement Cyclic Tests

Publisher： Cambridge University Press

E-ISSN： 1811-8216|27|2|191-200

ISSN： 1727-7191

Source： Journal of Mechanics, Vol.27, Iss.2, 2011-06, pp. : 191-200

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Abstract

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