Publisher: Trans Tech Publications
E-ISSN: 1662-0356|2016|98|103-108
ISSN: 1662-8969
Source: Advances in Science and Technology, Vol.2016, Iss.98, 2017-01, pp. : 103-108
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Thermal stability of on-chip copper interconnect structures
By Gutmann R.J. Chow T.P. Muraka S.P. Kaloyeros A.E. Lanford W.A.
Thin Solid Films, Vol. 262, Iss. 1, 1995-06 ,pp. :
Micromachined substrate slots for RF on‐chip isolation
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Vol. 57, Iss. 3, 2015-03 ,pp. :
By Wakamoto Y. Umehara S. Matsumura K. Inoue I. Yasuda K.
Sensors and Actuators B: Chemical, Vol. 96, Iss. 3, 2003-12 ,pp. :
Optimisation of Weld Overlay Cladding Parameters Using Full-Factorial Design of Experiment
Materials Science Forum, Vol. 2016, Iss. 880, 2017-02 ,pp. :