Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

E-ISSN： 1662-9795|2017|751|9-13

ISSN： 1013-9826

Source： Key Engineering Materials, Vol.2017, Iss.751, 2017-09, pp. : 9-13

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