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By Mastrangeli Massimo   Mermoud Grégory   Martinoli Alcherio  

Micromachines, Vol. 2, Iss. 2, 2011-03 ,pp. : 82-115

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Self-Assembly in Micro- and Nanofluidic Devices: A Review of Recent Efforts

By Khoo Hwa Seng   Lin Cheng   Huang Shih-Hao   Tseng Fan-Gang  

Micromachines, Vol. 2, Iss. 1, 2011-02 ,pp. : 17-48

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Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

By Morris Christopher J.   Isaacson Brian   Grapes Michael D.   Dubey Madan  

Micromachines, Vol. 2, Iss. 1, 2011-03 ,pp. : 69-81

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Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries

By Biswas Shantonu   Mozafari Mahsa   Stauden Thomas   Jacobs Heiko O.  

Micromachines, Vol. 7, Iss. 4, 2016-03 ,pp. : 54-54

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Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

By Fukushima Takafumi   Hashiguchi Hideto   Yonekura Hiroshi   Kino Hisashi   Murugesan Mariappan   Bea Ji-Chel   Lee Kang-Wook   Tanaka Tetsu   Koyanagi Mitsumasa  

Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 184-184

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