Publisher： Trans Tech Publications
E-ISSN： 1662-7482|2015|754|166-170
ISSN： 1660-9336
Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 166-170
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Abstract
The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu-xAl lead-free solder was systematically investigated. The Sn-0.7Cu-xAl solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%.
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