Interfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint Using Microwave Hybrid Heating

Publisher： Trans Tech Publications

E-ISSN： 1662-9795|2016|701|148-153

ISSN： 1013-9826

Source： Key Engineering Materials, Vol.2016, Iss.701, 2016-08, pp. : 148-153

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