A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength

Publisher: IOP Publishing

E-ISSN: 1361-6439|25|8|85015-85023

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.8, 2015-01, pp. : 85015-85023

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract