Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding

Author： Wang Xiaoqing Yu Yude Ning Jin

Publisher： MDPI

E-ISSN： 2072-666x|7|12|226-226

ISSN： 2072-666x

Source： Micromachines, Vol.7, Iss.12, 2016-12, pp. : 226-226

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