Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

Author： Wu Y.P. Alam M.O. Chan Y.C. Wu B.Y.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.44, Iss.2, 2004-02, pp. : 295-302

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