The evaluation of different base materials for high density flip chip on flex applications

Author： Palm Petteri   Määttänen Jarmo   Picault Alain   Maquillé Yannick De  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.18, Iss.3, 2001-12, pp. : 27-31

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