Surface treatment of wire bonding metal pads

Author: Alberici S.   Coulon D.   Joubin P.   Mignot Y.   Oggioni L.   Petruzza P.   Piumi D.   Zanotti L.  

Publisher: Elsevier

ISSN: 0167-9317

Source: Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 558-565

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