Reduced Cu interface diffusion by CoWP surface coating

Author： Hu C.-K.   Gignac L.   Rosenberg R.   Liniger E.   Rubino J.   Sambucetti C.   Stamper A.   Domenicucci A.   Chen X.  

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 406-411

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