Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won   Jung Seung-Boo  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

Springer Publishing Company

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The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

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Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging

By Li Xiaoyun  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1231-1237

Springer Publishing Company

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

By Tseng Chien-Fu   Duh Jenq-Gong  

Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

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Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

By Yang Shihua   Tian Yanhong   Wang Chunqing  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 11, 2010-11 ,pp. : 1174-1180

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