Thick film oxidation of copper in an electroplated MEMS process

Author： Lazarus N. Meyer C.D. Bedair S.S. Song X. Boteler L.M. Kierzewski I.M.

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.23, Iss.6, 2013-06, pp. : 65017-65025

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