A study of the mechanisms causing surface defects on sidewalls during Si etching for TSV (through Si via)

Author: Woon Leng Loh   Sampath Kumar Praveen   Murphy Ramana   Eugene Tan Kiat Swee   Jae Woong Choi  

Publisher: IOP Publishing

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.23, Iss.6, 2013-06, pp. : 65005-65011

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Abstract