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Journal of Electronic Materials, Vol. 36, Iss. 9, 2007-09 ,pp. : 1129-1136

Springer Publishing Company

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Lifetime Prediction and Design-for-Reliability of IC Interconnections with Electromigration Induced Degradation in the Presence of Manufacturing Defects

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Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip

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The Effect of Signal Activity on Propagation Delay of CMOS Logic Gates Driving Coupled On-Chip Interconnections

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Analog Integrated Circuits and Signal Processing, Vol. 31, Iss. 3, 2002-06 ,pp. : 209-224

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Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

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Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3179-3195

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