Metal-organic chemical vapor deposition of copper using hydrated copper formate as a new precursor

Author: Mouche M.-J.   Mermet J.-L.   Romand M.   Charbonnier M.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 1-6

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Abstract