Encapsulated copper interconnection devices using sidewall barriers

By Gardner D.S.   Vu Q.T.   Onuki J.   Kudoo K.   Misawa Y.  

Thin Solid Films, Vol. 262, Iss. 1, 1995-06 ,pp. : 104-119

Elsevier

Access to resources Recommend Favorite

High-reliability interconnection formation by a two-step switching bias sputtering process

By Onuki J.   Nihei M.   Koizumi M.  

Thin Solid Films, Vol. 266, Iss. 2, 1995-10 ,pp. : 182-188

Elsevier

Access to resources Recommend Favorite

Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

By Gutmann R.J.   Chow T.P.   Lakshminarayanan S.   Price D.T.   Steigerwald J.M.   Murarka S.P.   You L.  

Thin Solid Films, Vol. 270, Iss. 1, 1995-12 ,pp. : 472-479

Elsevier

Access to resources Recommend Favorite

Nanorecycling: Monolithic Integration of Copper and Copper Oxide Nanowire Network Electrode through Selective Reversible Photothermochemical Reduction

By  

ADVANCED MATERIALS, Vol. 27, Iss. 41, 2015-11 ,pp. : 6397-6403

John Wiley & Sons Inc

Access to resources Recommend Favorite

The bicube: an interconnection of two hypercubes

By  

International Journal of Computer Mathematics, Vol. 92, Iss. 1, 2015-01 ,pp. : 29-40

Taylor & Francis Ltd

Access to resources Recommend Favorite