Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane

Author： Lee W.-J. Rha S.-K. Lee S.-Y. Park C.-O. Kim D.-W.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.305, Iss.1, 1997-08, pp. : 254-258

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