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Elsevier

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Effect of composition on thermal stability and electrical resistivity of Ta-Si-N films

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Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO 2

By Hubner R.   Hecker M.   Mattern N.   Hoffmann V.   Wetzig K.   Wenger C.   Engelmann H.-J.   Wenzel C.   Zschech E.   Bartha J.W.  

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Evaluation of tantalum silicide sputtering target materials for amorphous Ta-Si-N diffusion barrier for Cu metallization

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Properties of thin Ta-N films reactively sputtered on Cu/SiO 2 /Si substrates

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