Thermal stability of copper nitride films prepared by rf magnetron sputtering

Author: Liu Z.Q.   Wang W.J.   Wang T.M.   Chao S.   Zheng S.K.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.325, Iss.1, 1998-07, pp. : 55-59

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract